Brown Engineers Beat the Dead Layer for Low-Power AI Chips

Brown Engineers Beat the Dead Layer for Low-Power AI Chips
The crystal structure of bismuth ferrite (BiFeO3), the multiferroic material at the center of the Brown study. Image: Nan Wang and Ya Yang, via Wikimedia Commons, CC BY 4.0. AI's appetite for electricity has become one of technology's defining problems. Better algorithms help, but some of the biggest long-term gains could come from rethinking the materials inside chips. Engineers at Brown University reported on October 28, 2026 that they have solved a long-standing obstacle for one promising...
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Eatsa: The San Francisco Eatery with a Virtual Cashier

The founders of Eatsa, a new fast food eatery in San Francisco, aimed to be different. The eatery provides an unprecedented, personalized ordering experience—with a “virtual cashier.”   “‘eatsa is reinventing fast food by combining the speed and affordability of fast food with the delicious flavors and nutritious ingredients of premium fast casual," said Tim Young, co-founder of eatsa.  ‘By developing new technology to automate every aspect of the food experience, we are able to d...
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